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    无铅锡膏

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    无铅锡膏(无铅系列)

    2019-05-25 15:14

     

     

        产品介绍  Product introduction

           
          ASH无铅系列锡膏使用高品质的锡粉和高稳定粘性的助焊膏混练而成;具有优异的连续印刷性、润湿性极佳、低空洞率、残留透明、具有高可靠性焊接效果;适用于各类智能通讯产品、智能家居电器产品、LED显示照明产品,新能源汽车等精密电子产品领域。
     ASH lead-free solder paste is made of high quality solder powder and high stability flux medium. It has excellentcontinuous printability, good wettability, low void rate, clear residue and good reliability in solder joint. It is suitable forcommunication products, smart home appliances, LED lighting industry, new energy automobile industry and many more.
             


    产品参数一览表
    List of Product Parameters

    助焊膏代码
    Flux Code

    H

    XG

    V4

    VC

    VC(WS)

    A6

    测试方法
    Test Method

    助焊膏含量(%)
    Flux Content

    11.5±1.0

    11.5±1.0

    11.0±1.0

    11.0±1.0

    14.0±1.0

    11.0±1.0

    JIS-Z-3197

    助焊膏类型
    Flux Type

    ROM1

    R0L1

    ROM1

    ROM1

    ROM1

    ROM1

    EN 14582

    粉末尺寸(μm)
    Powder Size

    3#(25~45μm)

    4#(20~38μm)

    5#(10~25μm)

     

    4#(20~38μm)

    5#(10~25μm)

    6#(5~15μm)

     

    3#(25~45μm

    4#(20~38μm)

     

    3#(25~45μm

    4#(20~38μm)

     

    4#(20~38μm)

    3#(25~45μm

    4#(20~38μm)

     

    JIS-Z-3197

    适用合金
    Alloy

    SAC0307、SAC105、SAC305

    Sn42Bi58

    Sn64Bi35Ag1.0

    Sn64.7Bi35Ag0.3

    JIS-Z-3282

    粘度(Pa.s)
    Viscosity

    200±30

    200±30

    200±30

    160±30

    200±30

    160±30

    JIS-Z-3284

    扩散(%)
    Spreading

    >78

    >85

    >78

    >78

    >78

    >78

    JIS-Z-3197

    坍塌(mm)

    Slump-in-printing

     

    ≤0.2

    ≤0.2

    ≤0.2

    ≤0.2

    ≤0.2

    ≤0.2

    JIS-Z-3284

    加热坍塌(mm)
    Slump-in-heating

    ≤0.3

    ≤0.3

    ≤0.3

    ≤0.3

    ≤0.3

    ≤0.3

    JIS-Z-3284

    绝缘阻抗
    Insulation Resistance

    >1.00×10^8Ω㎝

    >1.00×10^8Ω㎝

    >1.00×10^8Ω㎝

    >1.00×10^8Ω㎝

    >1.00×10^8Ω㎝

    >1.00×10^8Ω㎝

    JIS-Z-3284

    特    点
    Features

    低空洞,润湿性良好,
    松香透明,适应范围广

    low void rate, good wettability, clear residue, wide process window

     

    低卤,低空洞,超细间距
    印刷,润湿性良好,优异的
    热稳定性,活性良好

    Low halogen, low void rate, fine pitch printing, excellent wettability, good heat stability, good active

    持续印刷优异,无锡珠,
    低空洞率,活性优异

    Excellent continuous printing, low void rate, good active , no solder ball

    活性强,通用性强
    印刷良好,润湿性好

    Strong activity and versatilityGood printing and wettability

    水洗锡膏,易清洗

    Water-washed solder paste, easy to clean

    无锡珠,低空洞率,
    活性优异

    Low void rate, good active, no solder ball

    用    途
    Usage

    适用于家电、LED、
    电器等普通电子产品

    Common electronic parts for

     

    适用于智能产品、020101005、细间距IC器件

    Intellectual product, 0201 chip, 01005 chip, IC fine pitch parts

    LED类,散热器类,通孔工艺,低温焊接工艺

    Radiator, LED, through-hole process, welding in low temperature

    0.3BGA,0201,0.3IC
    等精密产品,4G智能手机
    ,模块等Precision products such as 0.3BGA, 0201, 0.3IC, 4G smartphones,

    LED类,散热器类,通
    孔工艺,低温焊接工艺

    Radiator, LED, through-hole process, welding in low temperature

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    深圳市ag8亚游集团电子材料有限公司
    Shenzhen Asahi Electronic Materials Co. Ltd.

     

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